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PCB（printed circuit board)

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2 layers PTFEC signal board 4 layers copper-plated board 4 layers high frequency signal board 2 layers high frequency signal board with copper-plated

Product Details

Brand: United Electech

Materials: FR4Tg135,Tg150,Tg170 ,Aluminum,Rogers,CEM-3

Solder mask color: LPI -Green, white ,black , blue , red , yellow etc

Copper thickness: 1OZ-10OZ or more

Surface finished: HAL , Hallf , ENIG,Immersion silver,OSP, Immersion Tin, Gold platting

Manufacturing Capabilities

Circuit Feature	Production(um)	Advanced(um)	Future(um)
Through Via Size (Drill Diameter)	200	200	200
Pad over drill size-inner layer	125	100	100
Pad over drill size-outer layer	125	100	100
Maximum Aspect Ratio	8:1	10:1	12:1
Plated via Diameter Tolerance	+/-76	+/-50	+/-50
Solder mask Registration Tolerance	+/-76	+/-50	+/-25
Layer to layer Registration Tolerance	+/-100	+/-76	+/-76
Layer count maximum	8	10~12	14~16
Panel size maximum (in mm)	550X650	550X650	550X650
Inner layer L/S minimum (0.5oz copper)	100/100	76/76	76/76
Inner layer L/S Tolerance (0.5oz copper)	+/-20	+/-15	+/-15
Inner layer L/S minimum (1.0oz copper)	125	100	76/100
Inner layer L/S Tolerance (1.0oz copper)	+/-25	+/-20	+/-15
Outer layer L/S minimum (0.5oz copper)	100/100	80/80	76/76
Outer layer L/S Tolerance (0.5oz copper)	+/-25	+/-20	+/-15
Outer layer L/S minimum (1.0oz copper)	125/125	100/100	76/76
Outer layer L/S Tolerance (1.0oz copper)	+/-25	+/-20	+/-20
Routed feature Tolerance (profile tolerance)	+/-125	+/-100	+/-50
Board thickness minimum (in mm)	0.3	0.2	0.15
Board thickness maximum (in mm)	2.5	3.2	4.0
Impedance control	+/-10%	+/-8%	+/-8%
Laminate Materials
FR4;Tg135,Tg150,Tg170	Yes	Yes	Yes
Cem-3	Yes	Yes	Yes
Ceramic	Yes	Yes	Yes
Aluminum Substrate	Yes	Yes	Yes
Rogers R4233，R4003	Yes	Yes	Yes
IS410，IS680	Yes	Yes	Yes
Blind and buried hole
Minimum blind hole	0.2	/	/
Blind hole layer/level	2	3	4
Mininum buried hole	0.2	/	/
Buried hole layer/level	1	/	/
Via-plugged (by epoxy)	0.2-1.2	/	/
Via-plugged (by solder resist ink)	0.2-0.6	/	/
Minimum drill hole size (Mechanical drilling)	0.2	/	/
Laser drilling (not in production currently. Outsourcing is available if necessary)	/	/	/

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